Beyond lead-free solders, Lichuang also sells BGA solder ball, solder tip thinner, tin dross reduction powder and solder wire tube.
1.BGA Solder Ball
The BGA (ball grid array package) solder ball, or lead-free solder ball is used to replace the pin in IC component package structure, meeting the demand of electrical interconnection and mechanical connection. The solder balls are usually applied to digital cameras, MP3/4, laptops, mobile phones, LED, home theatre, etc.
2.Solder Tip Thinner
After years of research and investigation, Lichuang launches solder tip tinner or cleaner which is good at renewing the oxidized tip. It produces little smoke and pungent smell.
3.Tin Dross Reduction Powder
The tin dross reduction power is a sort of while powder substance made up from inorganic reductant and some organic reductant. And it does not contain hazardous heavy metal elements, such as lead, cadmium, chromium and mercury.
4.Solder Wire Tube
Lichuang soldering wire tube features little smoke, little pungent odor, few residues and high insulation resistance. It is bright and clear from dust.
Lichuang (Taishan) Electronic Technology Co., Ltd
Address : Changlong Industrial Zone, Sijiu Town, Taizhou City
E-mail : firstname.lastname@example.org
Tel : +86-750-5482656
Tin is used to solder electrode welding rod. At elevated temperature and pressure conditions are not required to be used to seal solder metal welding. , Has good antioxidant capacity, high mobility, strong welding, scum rarely melts, and wave soldering immersion little oxidation, the provincial economy tin solder. Excellent wettability and solderability, solder full, uniform, welding with excellent results.
A low temperature solder of bismuth, indium, cadmium in the formation of solder in the solder alloy, mainly for microelectronic sensor assembly of parts with low heat resistance, good wettability and solderability, solder full, uniform welding excellent results, without requiring high temperatures and pressures may be used to seal solder metal welding.