Features
1. This medium-high temp Pb free Sn-Ag-Cu solder features high purity, excellent solder ability, good wettability, strong anti-oxidization, little solder residue, little solder spatter, little smoke and smell, fast soldering speed, great thermal fatigue resistance and good fluidity.
2. We manufacture the tin silver copper alloy for medium-high temperature according to RoHS and REACH standards.
3. Solder flux is uniformly distributed in Pb free Sn-Ag-Cu solders.
4. Solder joints rarely craze and shows great reliability as well as superior mechanical performance; besides, copper corrosion is weak.
5. This tin silver copper alloy for medium-high temperature needs no cleaning.
6. It has high insulation resistance.
7. Pb free Sn-Ag-Cu solders are widely utilized in soldering temp-sensitive components, LEDs and many other electronic elements.
Types
Sn96.5Ag3Cu0.5 Solder
Sn95.5Ag4Cu0.5 Solder
Sn95.8Ag3.5Cu0.7 Solder
Sn95.5Ag3.8Cu0.7 Solder
Parameters of Pb Free Sn-Ag-Cu Solder
|
Alloy Composition |
Melting Point (℃) |
Proportion |
Application |
|
|
Solidus |
Liquidus |
|||
|
Sn-3.0Ag-0.5Cu |
217 |
219 |
7.40 |
Hand Soldering and Wave Soldering |
|
Sn-4.0Ag-0.5Cu |
217 |
219 |
7.40 |
|
|
Sn-3.5Ag-0.7Cu |
217 |
217 |
7.40 |
|
|
Sn-3.8Ag-0.7Cu |
217 |
217 |
7.40 |
|
Lichuang (Taishan) Electronic Technology Co., Ltd
Address : Changlong Industrial Zone, Sijiu Town, Taizhou City
E-mail : globalsales2013@gmail.com
Tel : +86-21-60346873
