Sn97Ag3 Solder

Detailed Product Description

Introduction

As one of the lead free Sn-Ag alloy solders, Sn97Ag3 solder is also widely used because of good wettability, fast soldering speed, bright and smooth solder point surface, good fluidity and high thermal fatigue resistance. Its solidus is221 ℃, and liquidus is222℃.

Roles of Each Element

1. Silver provides mechanical strength, but it has weaker ductility than lead. In lead free Sn-Ag alloy solders, silver improves resistance to fatigue from thermal cycles.

2. Copper lowers the melting point, improves resistance to thermal cycle fatigue, and improves wetting properties of the molten solder. It also slows down the rate of dissolution of copper.

Parameters of Lead Free Sn-Ag Alloy Solders

Alloy Composition

Melting Point (℃)

Specific Gravity

Application

Solidus

Liquidus

Sn-3Ag

221

222

7.40

Hand Soldering and Wave Soldering

 

Tag:
Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

Other Products