Sn In Ag Bi Alloy Solder Bar

Detailed Product Description

Introduction

Sn-In-Ag-Bi solder alloy bars are widely used for soldering electronic components in radios, communication facilities, meters, instruments, and so on. Besides, tin indium silver bismuth alloy solder bar is utilized to solder copper, tin, iron and other metal products. It presents excellent soldering performance and physical properties.

Features

1. With quality no-clean flux inside, it shows great thermal conductivity.

2. During soldering, Sn-In-Ag-Bi solder alloy bars feature high melting speed, good fluidity, little solder spatter, uniform flux distribution, good flux continuity, little smoke, low copper corrosion, high insulation resistance, etc.

3. Residue is easy to remove by hot air after soldering work if necessary.

4. Tin indium silver bismuth alloy solder bar is available in soldering alloy metals.

5. Soldering joints are of smooth and bright surface, good mechanical performance and good moisture.

6. Sn-In-Ag-Bi solder alloy bars produce little tin slag because of strong anti-oxidization.

Types

Sn92In4Ag3.5Bi0.5 Solder Bar

Sn88In8Ag3.5Bi0.5 Solder Bar

Parameters of Common Sn-In-Ag-Bi solder Alloy Bars

Alloy Composition

Melting Point (℃)

Specific Gravity

Application

Solidus

Liquidus

Sn-4In-3.5Ag-0.5Bi

207

212

7.40

Hand Soldering and Wave Soldering

Sn-8In-3.5Ag-0.5Bi

196

206

7.40

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Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

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