Sn96Ag2.5Bi1Cu0.5 Solder Bar

Detailed Product Description

Introduction

This Sn-Ag-Bi-Cu solder alloy (Sn96Ag2.5Bi1Cu0.5) bar is a rosin-cored and lead-free product. It is applicable for soldering high-precision electronic products and heat-sensitive components, including LEDs, radios, instruments, meters, thermal overload protectors, etc.

Features

1. The (Sn96Ag2.5Bi1Cu0.5) Sn-Ag-Bi-Cu solder alloy bar features low melting point which is about 213 degrees Celsius.

2. With no-clean activated rosin flux inside, the tin silver bismuth copper alloy solder bars/wires show superior soldering performance.

3. Sn-Ag-Bi-Cu solder alloy bar presents high melting speed, favorable wetting property, distinguished electrical conductivity and extraordinary fluidity.

Element Composition

Element

Sn

Bi

Pb

Al

Sb

As

Cu

Fe

Zn

Cd

Ag

Ni

In

Proportion / %

The Rest

0.8-1.2

0.10

0.001

0.10

0.03

0.3-0.7

0.02

0.001

0.002

2.3-2.7

0.01

0.10

Physical Parameters of Sn-Ag-Bi-Cu Solder Alloy Bars (Sn96Ag2.5Bi1Cu0.5)

Alloy Composition

Melting Point (℃)

Specific Gravity

Application

Solidus

Liquidus

Sn-2.5Ag-1Bi-0.5Cu

213

218

7.40

Hand Soldering and Wave Soldering

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Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

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