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Introduction
Sn-Cu lead-free solder bars are commonly used in soldering metal equipments, copper tubes, copper plates, and so on. Adopting lead-free technology, it is environmentally friendly. Besides, our Sn99.3Cu0.7 solder enjoys finer grain structure and shinier surface than the conventional ones. As eutectic alloy, Sn-Cu solder rod has the melting point of227°C.
Features
1. Diameter of this Sn-Cu lead-free solder bar is more than0.2 mm.
2. It possesses a relatively low melting point.
3. High anti-oxidization makes only a little tin slag come into being.
4. Compared with conventional Sn99Cu1 alloys, this Sn99.3Cu0.7 solder shows advantages of low metal dissolution rate.
5. Optimum working temperatures ranges from260°Cto270°C.
6. Sn-Cu lead-free solder bar features good mechanical properties, strong thermal fatigue resistance, good fluidity, superior wetting characteristics and excellent soldering performance.
Parameters of Sn-Cu Solder Rod
| Series | Model | Representative Composition | Characteristics | Applicable Process | 
| Sn-Cu | LC-01-01 | Sn-0.7Cu | It features low melting point ,low using temperature, strong anti-oxidation property, good solder ability and thermal fatigue resistance. The surface of solder joints is bright and glazed, it is mainly used for manual soldering and wave soldering. | Manual Soldering, Wave Soldering | 
| LC-01-02 | Sn-1.5Cu | It is featured with low melting point, high using temperature, high anti-oxidation. It is mainly used for the disposable soldering for the stripping of enamelled wires. | Manual Soldering | |
| LC-01-03 | Sn-3.0Cu | 





Lantytk Solder Material
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E-mail : lanty.sh137@gmail.com
Tel : +86-21-60346873