Sn Ag Cu Solder

Detailed Product Description

Introduction

Sn-Ag-Cu solder belongs to lead-free products. Unlike the traditional lead solder, it is environmentally friendly and brings much less harm to human beings. Although Tin-silver-copper alloy solders are in more expensive than Sn-Cu solders, they are still widely applied in lead-free automatic wave soldering and other soldering processes because of good wettability and thermal resistance.

Advantages

1. Sn-Ag-Cu solder fulfills demands of RoHS (Restriction of the Use of Certain Hazardous Substances) and REACH (REGULATION Concerning the Registration, Evaluation,Authorization and Restriction of Chemicals).

2. Superior solder flux helps to increase soldering speed and fluidity.

3. Flux is uniformly distributed.

4. Only a little smoke and smells are released.

5. Cracks rarely arise at soldering points. Besides, surface of the Sn-Ag-Cu solder is protected from copper corrosion.

6. Tin-silver-copper alloy solders feature high insulation resistance. With little slag, it is free from cleaning.

Typical Sn-Ag-Cu Solders

92Sn-6Cu -2Ag

95Sn-4Cu -1Ag

99.3Sn-0.7Cu -0.3Ag

Constitutions of Sn-Ag-Cu Solders

Alloy Constitutions

Melting Point℃

Specific Gravity

Applications

Solidus

Liquidus

92Sn-6Cu -2Ag

217

373

7.50

Hand/Automatic Soldering

95Sn-4Cu -1Ag

217

335

7.40

99.3Sn-0.7Cu -0.3Ag

217

226

7.30

 

Flux for Sn-Ag-Cu Solders

 

Code

Item

 

Lc--T-1

 

Lc--H-1

 

Lc--P-1

 

Lc--Hf01

 

Lc--Ws01

Fluex Content (%)

2.2±1.0

2.5 ± 0.5

2.2 ± 1.0

3.0 ± 0.5

2.5 ± 0.5

Halide Content (%)

0.05--0.1

<0.05

<0.05

0

0.1--0.2

Fluorine Content (%)

None

None

None

None

None

Silver Chromate Test

Pass

Pass

Pass

Pass

Pass

Copper Mirror Test

Pass

Pass

Pass

Pass

Pass

Copper Plate Corrosion Test

 

Pass

 

Pass

 

Pass

 

Pass

 

Pass

Sir

>1 × 1011

>1 × 1010

>1×1011

>1 × 1011

>1 × 1011

(After Cleaning)

Electro Migration

Pass

Pass

Pass

Pass

PASS

(After Cleaning)

Characteristic

It belongs to halogen-free solder and enjoys wide range of applications.

It is used in soldering nickeling elements and lamp holders.

It is used to solder zinc electrode for capacitors.

It contains little halogen.

Its residue is washable.

 

SIR Test Condition:40℃, 95% RH, 96h 

Electro Migration Test Condition:65℃, 85%RH

Diameter of Sn-Ag-Cu Solder Wire:0.3 mmto12.0 mm





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Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

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