Detailed Product Description

Introduction

This tin silver copper alloy solder wire/bar/rod (Sn99Ag0.3Cu0.7) is also known as SAC0307 lead-free solder. It is applicable for precise LED, mobile phone chips, PCBs, etc. in many hi-tech wave soldering machines and small-sized tin furnaces. With composition of 99% tin, 0.3% silver and 0.7% copper, the lead free Sn-Cu-Ag solders have a high melting point; besides, its lead content is below 100 ppm such as to meet customers’ requirements of environment protection. 


Features

1. Flux content is 2%, the wire diameter reaches over0.15 mm.

2. Our tin silver copper alloy solder wire/bar/rod is produced strictly according to RoHS directive and SS-00259 standards.

3. Two kinds of materials are adopted: the 99.99% refined electrolytic lead and the 99.97% refined quality tin.

4. Lead free Sn-Cu-Ag solders produced by us are popularly sold. They have been exported to countries likePoland,Argentina,Peru,Pakistan,Italy, and so on.

Parameters of Tin Silver Copper Alloy Solder Wire/Bar/Rod (Sn99Ag0.3Cu0.7)

Specification

Sn99-Ag0.3-Cu0.7

Appearance

Lucent, No dirt on Surface

Packing

G.W.:500g/roll,10 kg/ctn.

Chemical Components

Sn

Ag

Cu

Pb

Sb

Bi

Zn

Fe

Al

As

Cd

Residue Content

0.3 ± 0.1

0.7 ± 0.2

<0.1

<0.1

<0.06

<0.001

<0.02

<0.001

<0.03

<0.002

Physical Properties 

Alloy Component

Melting Point, ℃

Tensile Strength, g/cm3

Rigidity HB

Heat Conductivity M.S.K

Tensile Strength, MPa

Elongation Rate, %

Electric Conductivity, %

Sn99Ag0.3Cu0.7

230

7.4

9

64

32

48

16.0



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Contact Details

Lichuang (Taishan) Electronic Technology Co., Ltd

Address : Changlong Industrial Zone, Sijiu Town, Taizhou City

E-mail : li-chuang@china-hanxi.com

Tel : +86-750-5482656

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