Compared with tin wire or solder paste, Sn63Pb37 solder sheet and Sn96.5Ag3.0Cu0.5 solder sheet have advantages of accurate solder quantity, less flux, less residue, high reliability, good solder joint, and so on.
Sn63Pb37 solder sheet and Sn96.5Ag3.0Cu0.5 solder sheet are widely applied in slit assembly, large plane welding, and so on.
|Item||Sn63Pb37 Solder Sheet||Sn96.5Ag3.0Cu0.5 Solder Sheet|
|Product name||Tin sheet||Tin sheet|
|Size||8mm × 8mm × 0.3mm||8mm × 8mm × 0.3mm|
Lichuang (Taishan) Electronic Technology Co., Ltd
Address : Changlong Industrial Zone, Sijiu Town, Taizhou City
E-mail : firstname.lastname@example.org
Tel : +86-750-5482656
Solder ball is widely used in modern microelectronics, IC manufacturing process is a function of notebook computers, mobile communication devices, computer motherboards, light emitting diodes, liquid crystal displays, PDA, digital photos and other products with the essential craft materials, particularly play a crucial role in the process of LSI miniature.